Abstract:

In order to solve the machining accuracy problem of flexible thin devices, as well as to improve the manufacturing yield, a strategy was peoposed that de-bonded thin flexible device from carrier at room temperature and stress free. Thermal stability, chemical resistance and ultraviolet transmittance of two materials were studied by characterization using thermo-gravimetric anslysis, UV-visible spectrophotometer and so on. The results show that the 5% weightlessness of laser response material and temporary bonding material were hhgher than 597 °C in nitrogen gas and 412 °C in air, respeectively. The temporary bonding pair with these glues has good chemical resistance. The UV transmittance of the laserresponse material with 566 nm thickness at 355 nm is 4.96%. Finally, basedon the 20 cm silicon wafer, a complete set of process validation and good results have been obtained, which provides a high and reliable solution for future flexible ultra-thin chip or device processing.

Key words: temporary bonding, laser de-bonding, ultra-thin processing, flexible wearable